Samsung Electro-Mechanics said on July 2 that it signed a master agreement with Dongwoo Fine-Chem, a wholly owned subsidiary of Japan’s Sumitomo Chemical Group, to jointly establish a venture named “Glassem” to produce glass core materials used in glass substrates, according to Jiemian News.
On the same day, BOE Technology Group unveiled its glass-substrate packaging carrier board business to the market for the first time at its 2026 Investor Day event. The report said the glass-substrate theme has remained strong in China’s A-share market and has drawn attention across the advanced semiconductor packaging supply chain, as the industry looks beyond traditional organic substrates that are nearing performance and reliability limits.