TOKYO--Japan's Ministry of Finance said Tuesday it plans to auction Y700.0 billion of 20-year government bonds on Jul. 14, 2026.

Issue 20-year govt bond Auction Date Jul 14, 2026 Settlement Date Jul 15, 2026 Maturity Date Jun 20, 2046 Offer Amount Y700.0 Billion

This content was automatically published based on data and/or text from the original source. For feedback, write to singaporeeditors@dowjones.com.