SK Hynix announced at FMS 2026 that it has jointly released the first High Bandwidth Flash standard specification with Sandisk, about six months after the two companies formed an alliance in February. According to ChainCatcher, the standard was published through OCP and covers key specifications including capacity of up to 512GB, bandwidth in three tiers with a maximum of about 3.0TB/s, and the use of a UCIe interconnect interface.
Google and Tenstorrent have confirmed they are joining the HBF alliance. The technology is positioned as a storage tier between HBM and SSD, combining HBM-like high-speed transmission with NAND-level capacity expansion.
SK Hynix also publicly displayed its 10th-generation V10 375-layer 4D NAND wafer and products for the first time during the event. The company said energy efficiency is 2.5 times higher than the previous generation and expects mass production to begin early next year. In its conference presentation, the company said a tiered memory architecture is intended to address data-processing challenges in the AI inference era.