Samsung Electronics' semiconductor division recently formed a BEOL (back-end-of-line) process organization within its etching technology team under the memory business unit.
According to Odaily, the organization is scheduled to be fully established this month and will begin operations at the Pyeongtaek campus, initially comprising around 30 members, most of whom are senior engineers.
The discussions include securing BEOL process technology for high-value memory such as HBM, personnel allocation, and strengthening supply chain operations. BEOL refers to the metal wiring formation process in the later stage of semiconductor front-end processing, used to connect devices and transmit signals after wafer device formation.
Samsung began shipping HBM4 in the first half of this year, with 2,048 I/O, double that of the previous generation. Increasing the number of I/O within a limited chip area requires denser wiring and smaller line widths, imposing higher demands on metal wiring formation and etching precision.
The organization is still in its early formation stage, and specific operational directions and goals will be clarified later.