- Intel to invest €5B in Leixlip Fab 34 upgrade: add Intel 3 tooling, boost automated wafer flow and capacity for Xeon 6 and next‑gen Xeon server CPUs; supports data‑center production and R&D.
- Intel installed a High-NA EUV lithography tool at its Hillsboro R&D site in 2024. The ~$400M tool is used for select layers in Intel’s 18A process to boost yield.
- KeyBanc kept Overweight on Intel (INTC) and raised its price target from $110 to $155 per share; update focuses solely on INTC's revised valuation.
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Key facts: Intel €5B Leixlip upgrade; High‑NA EUV Hillsboro; PT $155
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Intel to invest €5B in Leixlip Fab 34 upgrade: add Intel 3 tooling, boost automated wafer flow and capacity for Xeon 6 and next‑gen Xeon server CPUs; supports data‑center productio