Resideo Technologies advanced the planned separation of its ADI Global Distribution business with two financing steps. The company completed a $400 million offering of 7.125% senior notes due 2034, with proceeds held in escrow until spin-off conditions are met or redeemed if not satisfied by Dec. 31, 2026. Resideo also entered a new senior secured Credit Agreement for ADI Funding comprising a $600 million term loan and a $500 million revolving facility led by JPMorgan, effective upon completion of the spin-off. Together, the financings will fund an approximately $900 million dividend to Resideo and support transaction costs and liquidity.
Agreement 1: Resideo Technologies Completes $400 Million 7.125% Senior Notes Due 2034
- Agreement type: $400 million 7.125% Senior Notes due 2034 (Indenture)
- Counterparty: U.S. Bank Trust Company, as trustee
- Signed / Effective: Jun 30 2026 / same
- Duration / Termination: Matures Jul 15 2034
- Reason: Finance ADI spin-off and provide related funding flexibility
Agreement 2: Resideo Technologies Enters $1.1 Billion Senior Secured Credit Facilities Led by JPMorgan
- Agreement type: Senior secured credit facilities ($600M term loan; $500M revolver)
- Counterparty: JPMorgan Chase Bank, as administrative agent, and other lenders
- Signed / Effective: Jul 01 2026 / same
- Duration / Termination: 7-year term loan; 5-year revolver after spin-off
- Reason: Fund dividend to parent and support ADI spin-off liquidity
Original SEC Filing:
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