Taiwan Semiconductor (TWSE:2330) raised AI capex sharply—2026 up 30–88% YoY and 2027 about +30%—as its parts-localization program, including a tie-up with Winbond to localize critical memory, boosts annual output and halves validation time for AI hardware.
Previous Week Recap
- TSMC AI Capex Outlook Rises: Taiwan Semiconductor (ADR 2330) raised AI-related capex outlook: 2026 AI capex up 30–88% YoY and 2027 AI capex about +30% YoY versus prior guidance.
- TSMC Localizes Parts, Partners With Winbond: TSMC’s parts localization program has boosted annual output and halved validation time; TSMC announced a collaboration with Winbond to localize critical memory production for AI hardware.
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